I-Thermalright LGA1700-BCF/AMD-ASF CPU Bending Correction Fixing Buckle CNC Aluminium Alloy ye-Intel Gen 12/AMD RYZEN 7000 CPU

Incazelo emfushane:

  • I-Thermalright LGA1700-BCF/AMD-ASF CPU Ukulungisa Ibhande Elilungisiwe I-Buckle CNC Aluminium Alloy ye-Intel Gen 12/AMD RYZEN 7000 CPU
  • ye-Intel 12th isizukulwane CPU
  • Ukucaciswa:
  • Igama: I-CPU Anti-Bending Frame
  • Material: aluminium ingxubevange
  • Umbala: omnyama, ompunga, obomvu, oluhlaza okwesibhakabhaka (uma uthanda)
  • Kuyasebenza: Nikeza kuphela ukwesekwa kwe-Intel 12th generation CPU, isokhethi le-CPU lebhodi lomama yi-LGA1700, kanti i-chipset inguchungechunge lwe-H610 B660 Z690.
  • Usayizi: Ubude 54mm Ububanzi 70mm Ukuphakama 6mm
  • Isisindo: umzimba oyinhloko 20g;ngokuphelele 50g
  • Incazelo yomkhiqizo:
  • I-Thermalright idala isixazululo sokugoba samaphrosesa we-Intel's Alder Lake
  • Kuma-Intel's Alder Lake processors athambekele ekuguquguqukeni nasekuphikisaneni, okuyiphutha ohlelweni lwe-Intel LGA1700 CPU's latching.Ekuphenduleni le nkinga, "uhlaka oluphikisana nokugoba" lwakhiwe, olwakhelwe ukuvimbela ukulwa/ukugoba kwama-CPU e-Alder Lake.
  • I-LGA1700-BCF, ifreyimu ye-aluminium ethatha indawo ye-CPU mounting mechanism ye-LGA1700 CPU socket yenkampani.Lo zimele ulingana nephrosesa futhi uvikelwe ngezikulufu ezilula.Uhlaka lusebenza ngisho nokucindezela okukhulu kuma-Intel's Alder Lake processors, kunciphisa ithuba lokungqubuzana.Kodwa-ke, i-Intel ixwayisa ngokuthi lesi sixazululo esikhulayo singase sichithe iwaranti yakho ye-CPU, ngakho abathengi kufanele bakuqaphele lokhu.
  • Le LGA 1700 Anti-Bend Buckle yamukela inqubo ye-aluminum CNC yegolide ene-anodized sandblasting, enosayizi ophelele ongu-70 x 54 x 6 mm kanye nesisindo sisonke esingu-50g.Ukuma kwayo okunembayo kungagwema ama-capacitor ebhodini lomama, futhi kusebenzisa amaphedi okuvikela ukufakwa kwe-LOTES okuqala, futhi ihlinzeka nezikimu zemibala ezihlukene.
  • Uma kuqhathaniswa nabakaki abenziwe ekhaya bangaphambili, leli bhande le-LGA 1700 elimelene nokugoba libanzi kakhulu ekwakhiweni kanye nekhwalithi engcono.Ngaphezu kwalokho, intengo iyathengeka kakhulu.I-Z690, B660 kanye ne-H610 motherboards angasebenzisa lesi siqeshana esilwa nokugoba se-LGA 1700
  • Isici:
  • 1. Ukuqhathanisa: Uma kuqhathaniswa neminye imikhiqizo efanayo, lo mkhiqizo usebenzisa ukucindezela okuphansi okunezinhlangothi ezine esikhundleni sokucindezela kwamaphuzu amaningi, ngokuma okunembile, ukugwema amandla, okuhambisana nokulungiswa kwe-CPU;
  • 2. Iphedi yokuvikela ukufakwa kwe-insulation: Indawo yokuxhumana enebhodi eliyinhloko iphansi eliyisicaba, futhi iphedi yokuqala ye-LOTES yokuvikela ukwahlukanisa yencazelo efanayo isetshenziselwa ukunciphisa ukucindezela ebhodini elikhulu futhi kunciphise nakakhulu ukuphazamiseka kwesignali;
  • 3. Ukuphazamiseka kwesignali: Ingaphezulu lensimbi liyaphakanyiswa ukuze kuncishiswe ukuphazamiseka kwesignali ohlangothini lwebhodi lomama;
  • 4. Okubalulekile: Le divayisi ye-CPU ye-orthotic inemibala emibili: emnyama nebomvu.Yenziwe nge-anodized sand blasting yonke i-aluminium alloy CNC precision machining, isebenzisa i-insulation pad yenjoloba yokuqala, futhi ihlanganiswe nezikulufu zesokhethi ezine-hexagonal.Kulula ukuyifaka futhi inganciphisa ukungena kwamafutha we-silicone emaphethelweni e-CPU;
  • 5. Incazelo: Ngenxa yomklamo wekhava ephezulu ye-AMD Ryzen 7000 “emise okwesipesheli” ye-CPU, lapho ufaka irediyetha, ngenxa yengcindezi yokufaka, kuzoba ne-thermal conductive silicone grease extruded, ezonqwabelana ku-Gap of i-AMD Ryzen 7000 CPU, okungenzeka kube nzima ukuyisusa, noma ivuze ku-capacitor, okungase kube yingozi yokuphepha.
  • ye-AMD RYZEN 7000
  • Umsuka: I-Mainland China
  • Inombolo Yemodeli: I-CPU Bracket
  • Uhlobo: Isibambi se-CPU
  • Umbala: Mnyama, obomvu (uma uthanda)
  • Izakhiwo: Awekho amafutha e-silicone, afakwe i-silicone grease (uyazikhethela)
  • Material: Aluminium ingxubevange
  • Inqubo: CNC anode Sanding
  • Ukulungisa izesekeli: I-screwdriver yohlobo lwe-L
  • Usayizi: 70x54x6mm/2.76×2.13×0.24in
  • Isisindo: Umzimba 20g, jikelele 55g
  • Inqubo yokufaka:
  • 1. Beka i-motherboard ivundlile kudeskithophu bese uvula isiqeshana se-CPU
  • 2. Sebenzisa i-screwdriver ye-T20 Torx enamathiselwe ukuze ukhiphe ingxenye engenhla bese ubeka eceleni isibambiso esingezansi.
  • 3. Faka i-CPU phakathi
  • 4. Mboza i-snap ethuthukisiwe kukhava engaphezulu ye-CPU bese uyinyakazisa ngobumnene ize ichofoze endaweni.
  • 5. Qinisa izikulufu kwelinye i-engeli ngokujika ingxenye.Isikulufu ngasinye sithatha uhhafu wethuba ngokuhleleka kwe-diagonal size siboshwe, sizofaka ingcindezi ku-CPU ngokungalingani
  • Qaphela:
  • Ngaphandle kwamafutha ashisayo.
  • Ngenxa yokuqapha okuhlukile nomthelela wokukhanya, umbala wangempela wento ungase uhluke kancane kumbala oboniswe ezithombeni.Ngiyabonga!
  • Sicela uvumele umehluko we-1-2cm wokulinganisa ngenxa yesilinganiso sokulinganisa.
  • iphasela
  • 1X Ikhithi Yozimele Yokugoba
  • I-screwdriver emise okwe-1X

Imininingwane Yomkhiqizo

Omaka bomkhiqizo

Bonisa imininingwane

I-Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen (1)
I-Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen (2)
I-Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen (3)
I-Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen (5)
I-Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen (4)
I-Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen

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