I-Thermalright LGA1700-BCF/AMD-ASF CPU Ukulungisa Ukulungisa Ibhande CNC Aluminium Alloy ye-Intel Gen 12/AMD RYZEN 7000 CPU Isithombe Esifakiwe

I-Thermalright LGA1700-BCF/AMD-ASF CPU Bending Correction Fixing Buckle CNC Aluminium Alloy ye-Intel Gen 12/AMD RYZEN 7000 CPU

Incazelo emfushane:

I-Thermalright LGA1700-BCF/AMD-ASF CPU Ukulungisa Ibhande Elilungisiwe I-Buckle CNC Aluminium Alloy ye-Intel Gen 12/AMD RYZEN 7000 CPU
ye-Intel 12th isizukulwane CPU
Ukucaciswa:
Igama: I-CPU Anti-Bending Frame
Material: aluminium ingxubevange
Umbala: omnyama, ompunga, obomvu, oluhlaza okwesibhakabhaka (uma uthanda)
Kuyasebenza: Nikeza kuphela ukwesekwa kwe-Intel 12th generation CPU, isokhethi le-CPU lebhodi lomama yi-LGA1700, kanti i-chipset inguchungechunge lwe-H610 B660 Z690.
Usayizi: Ubude 54mm Ububanzi 70mm Ukuphakama 6mm
Isisindo: umzimba oyinhloko 20g; ngokuphelele 50 g
Incazelo yomkhiqizo:
I-Thermalright idala isixazululo sokugoba samaphrosesa we-Intel's Alder Lake
Kuma-Intel's Alder Lake processors athambekele ekuguquguqukeni nasekuphikisaneni, okuyiphutha ohlelweni lwe-Intel LGA1700 CPU's latching. Ekuphenduleni le nkinga, "uhlaka oluphikisana nokugoba" lwakhiwe, olwakhelwe ukuvimbela ukulwa/ukugoba kwama-CPU e-Alder Lake.
I-LGA1700-BCF, ifreyimu ye-aluminium ethatha indawo ye-CPU mounting mechanism ye-LGA1700 CPU socket yenkampani. Lo zimele ulingana nephrosesa futhi uvikelwe ngezikulufu ezilula. Uhlaka lusebenza ngisho nokucindezela okukhulu kuma-Intel's Alder Lake processors, kunciphisa ithuba lokungqubuzana. Kodwa-ke, i-Intel ixwayisa ngokuthi lesi sixazululo esikhulayo singase sichithe iwaranti yakho ye-CPU, ngakho abathengi kufanele bakuqaphele lokhu.
Le LGA 1700 Anti-Bend Buckle yamukela inqubo ye-aluminum CNC yegolide ene-anodized sandblasting, enosayizi ophelele ongu-70 x 54 x 6 mm kanye nesisindo sisonke esingu-50g. Ukuma kwayo okunembayo kungagwema ama-capacitor ebhodini lomama, futhi kusebenzisa amaphedi okuvikela ukufakwa kwe-LOTES okuqala, futhi ihlinzeka nezikimu zemibala ezihlukene.
Uma kuqhathaniswa nabakaki abenziwe ekhaya bangaphambili, leli bhande le-LGA 1700 elilwa nokugoba libanzi kakhulu ekwakhiweni kanye nekhwalithi engcono. Ngaphezu kwalokho, intengo iyathengeka kakhulu. I-Z690, B660 kanye ne-H610 motherboards angasebenzisa lesi siqeshana esilwa nokugoba se-LGA 1700
Isici:
1. Ukuqhathanisa: Uma kuqhathaniswa neminye imikhiqizo efanayo, lo mkhiqizo usebenzisa ukucindezela okuyisicaba okunezinhlangothi ezine esikhundleni sokucindezela kwamaphuzu amaningi, ngokuma okunembile, ukugwema amandla, okuhambisana nokulungiswa kwe-CPU;
2. Iphedi yokuvikela ukufakwa kwe-insulation: Indawo yokuxhumana enebhodi eliyinhloko iphansi eliyisicaba, futhi iphedi yokuqala ye-LOTES yokuvikela ukwahlukanisa yencazelo efanayo isetshenziselwa ukunciphisa ukucindezela ebhodini elikhulu futhi kunciphise nakakhulu ukuphazamiseka kwesignali;
3. Ukuphazamiseka kwesignali: Ingaphezulu lensimbi liyaphakanyiswa ukuze kuncishiswe ukuphazamiseka kwesignali ohlangothini lwebhodi lomama;
4. Okubalulekile: Le divayisi ye-CPU ye-orthotic inemibala emibili: emnyama nebomvu. Yenziwe nge-anodized sand blasting yonke i-aluminium alloy CNC precision machining, isebenzisa i-insulation pad yenjoloba yokuqala, futhi ihlanganiswe nezikulufu zesokhethi ezine-hexagonal. Kulula ukuyifaka futhi inganciphisa ukungena kwamafutha we-silicone emaphethelweni e-CPU;
5. Incazelo: Ngenxa yomklamo wekhava ephezulu ye-AMD Ryzen 7000 “emise okwesipesheli” ye-CPU, lapho ufaka irediyetha, ngenxa yengcindezi yokufaka, kuzoba ne-thermal conductive silicone grease extruded, ezonqwabelana ku-Gap of i-AMD Ryzen 7000 CPU, okungenzeka kube nzima ukuyisusa, noma ivuze ku-capacitor, okungase kube yingozi yokuphepha.
ye-AMD RYZEN 7000
Umsuka: I-Mainland China
Inombolo Yemodeli: I-CPU Bracket
Uhlobo: Isibambi se-CPU
Umbala: Mnyama, obomvu (uma uthanda)
Izakhiwo: Awekho amafutha e-silicone, afakwe i-silicone grease (uyazikhethela)
Material: Aluminium ingxubevange
Inqubo: CNC anode Sanding
Ukulungisa izesekeli: I-screwdriver yohlobo lwe-L
Usayizi: 70x54x6mm/2.76×2.13×0.24in
Isisindo: Umzimba 20g, jikelele 55g
Inqubo yokufaka:
1. Beka i-motherboard ivundlile kudeskithophu bese uvula isiqeshana se-CPU
2. Sebenzisa i-screwdriver ye-T20 Torx enamathiselwe ukuze ukhiphe ingxenye engenhla bese ubeka eceleni isibambiso esingezansi.
3. Faka i-CPU phakathi
4. Mboza i-snap ethuthukisiwe kukhava engaphezulu ye-CPU bese uyinyakazisa ngobumnene ize ichofoze endaweni.
5. Qinisa izikulufu kwelinye i-engeli ngokujika ingxenye. Isikulufu ngasinye sithatha uhhafu wethuba ngokuhleleka kwe-diagonal size siboshwe, sizofaka ingcindezi ku-CPU ngokungalingani
Qaphela:
Ngaphandle kwamafutha ashisayo.
Ngenxa yokuqapha okuhlukile nomthelela wokukhanya, umbala wangempela wento ungase uhluke kancane kumbala oboniswe ezithombeni. Ngiyabonga!
Sicela uvumele umehluko we-1-2cm wokulinganisa ngenxa yesilinganiso sokulinganisa.
iphasela
1X Ikhithi Yozimele Yokugoba
I-screwdriver emise okwe-1X