I-AMD AM5 Ryzen DDR5 PC Motherboard PRO B650M M-ATX Motherboard
Incazelo emfushane:
Isicelo
Ukunikezwa kwamandla okunamandla: Kufakwe imojula yokuphakelwa kwamandla ephezulu. Isibonelo, amanye amabhodi omama asebenzisa idizayini yokuphakelwa kwamandla ezigaba eziningi, enganikeza ukusekela kwamandla okuzinzile nokwanele kumaphrosesa ochungechunge lwe-AMD's Ryzen. Lokhu kuqinisekisa ukuthi iphrosesa ingakwazi ukusebenza ngokuzinzile ngaphansi kwemisebenzi elayisha kakhulu futhi isebenzise ngokugcwele ukusebenza kwayo, noma ngabe okomsebenzi wansuku zonke wasehhovisi noma imisebenzi enzima efana nokudlala nokunikezela.
Ukusekelwa Kwenkumbulo Yemvamisa Ephakeme: Isekela inkumbulo ye-DDR5 futhi inezinga elithile lekhono lokudlula inkumbulo. Ivumela abasebenzisi ukuthi baqhubeke nokwandisa imvamisa yenkumbulo ngokwezidingo zabo, ngaleyo ndlela bathuthukise isivinini sokusebenza kwesistimu namandla okucubungula idatha. Amanye amabhodi omama angakwazi ukusekela amaza enkumbulo afika ku-6666MHz noma ngisho nangaphezulu, athuthukise kakhulu umkhawulokudonsa wememori nesivinini sokudluliswa kwedatha.
Ukudluliswa Kwedatha Yesivinini Esikhulu: Iza ne-PCIe 5.0 slots. Uma kuqhathaniswa ne-PCIe 4.0, i-PCIe 5.0 inikeza umkhawulokudonsa ophezulu kanye nesivinini sokudlulisa idatha esisheshayo, esingahlangabezana nezidingo zamadivayisi wokugcina anesivinini esikhulu esizayo kanye namakhadi ehluzo asebenza kahle kakhulu. Lokhu kuvumela i-motherboard ukuthi isebenzise kangcono amandla wehadiwe esebenza kahle kakhulu.
Idizayini Enhle Kakhulu Yokukhipha Ukushisa: Ngokuvamile inomklamo omuhle wokukhipha ukushisa ukuze kuqinisekiswe ukuzinza ngesikhathi sokusebenza komthwalo omkhulu. Isibonelo, ifakwe osinki bokushisa bendawo enkulu abahlanganisa imojula yokuphakela amandla, i-chipset nezinye izindawo ezinokushisa okuphezulu. Amanye ama-motherboard aphinde asebenzise ipayipi lokushisa nobunye ubuchwepheshe bokukhipha ukushisa ukuze asuse ukushisa ngokushesha nangempumelelo, ehlise izinga lokushisa le-motherboard futhi agweme ukuwohloka kokusebenza noma ukulimala kwehadiwe okubangelwa ukushisa ngokweqile.
I-Rich Expansion Interfaces: Ine-interface ehlukahlukene yokunweba ukuze ihlangabezane nezidingo ezihlukile zabasebenzisi. Lokhu kufaka phakathi ukuxhumana okuningi kwe-USB (okufana ne-USB 2.0, i-USB 3.2 Gen 1, i-USB 3.2 Gen 2, njll.), izindawo zokuphuma kwevidiyo ezifana ne-HDMI ne-DisplayPort yokuxhuma iziqapha, izixhumanisi ze-SATA eziningi zokuxhuma ama-hard disk nama-optical drive, kanye ne-M. 2 izixhumanisi zokufaka amadrayivu e-solid state anesivinini esikhulu.
Ikhadi Lenethiwekhi Ye-Onboard kanye Nemisebenzi Yomsindo: Ihlanganiswe nekhadi lenethiwekhi elisebenza kahle kakhulu, ngokuvamile ikhadi le-2.5G Ethernet, ukuze linikeze uxhumano lwenethiwekhi olusheshayo noluzinzile. Ngokuphathelene nomsindo, ifakwe ama-chips omsindo wekhwalithi ephezulu nama-capacitor ukuletha okuphumayo komsindo othembekile.
Imisebenzi ye-BIOS Ecebile: Ifaka isixhumi esibonakalayo esicebile se-BIOS esivumela abasebenzisi ukuthi balungise futhi basethe imingcele efana nefrikhwensi yephrosesa, i-voltage, nemingcele yememori ngokuningiliziwe. Iphinde inikeze imisebenzi engokoqobo efana nokuqapha izingxenyekazi zekhompuyutha, izilungiselelo zento yokuqalisa, nezilungiselelo zokuphepha, ukusiza abasebenzisi ukuphatha nokugcina ibhodi lomama nohlelo.